Sadechaf
Surface Mount Adhesives
At Sadechaf Adhesives, we understand the critical role that reliable adhesives play in the electronics manufacturing process. Our Surface Mount Adhesives (SMAs) are specifically formulated to meet the high standards of precision and durability required in the assembly of electronic components. Ideal for use in Surface Mount Technology (SMT), our adhesives ensure excellent bond strength, fast curing times, and robust resistance to thermal and mechanical stress, supporting the integrity and functionality of your electronic devices. Whether you are working on small gadgets or large-scale industrial electronics, explore our range to find the perfect adhesive solution for your SMT applications.
Request your free sample today, or plan a meeting with our team of adhesive experts to find a solution for your application.
Sadechaf Surface Mount Adhesives
| Adhesive | Chemistry | Components | Cure | Colour | Key-Properties | Viscosity @ 23°C | TDS | Sample |
|---|---|---|---|---|---|---|---|---|
| SPE 1888 | Epoxy | 1-part | Heat (+120°C) | Black & Fluorescent for in-line QC | Fast curing during reflow process between 195 – 230°C, Cures during Pb-free solder reflow while allowing self-alignment of IC components, Can be pre-applied to the board using a standard SMA dispenser, Toughened, Low-Outgassing, high Tg, Low shrinkage, Excellent Heat & Chemical resistance, Good weatherability, Electrically insulating, Gap filling, Tack-free cure, Excellent impact, shock and vibration resistance. | 86.000 mPas, Thixotropic gel | TDS SPE 1888 | Sample SPE 1888 |
| SPE 1927 | Epoxy | 1-part | Heat (+120°C) | Black & Fluorescent for in-line QC | Toughened, Low outgassing, High Tg, Low Shrinkage, Resistant against High temperature (+150°C) and Thermal cycling, Resistant against aggressive Chemicals and Moisture, Electrically insulating, Gap filling, Excellent resistance against Shock, Vibration and Impact | 120.000 mPas | TDS SPE 1927 | Sample SPE 1927 |
