Electronics
At Sadechaf we offer superior adhesive solutions for the electronics sector. Our products are specifically formulated to address the unique challenges of electronic assembly and manufacturing. Whether you are working on circuit boards, semiconductor packaging, or electronic components, our adhesives provide reliable, strong, and precise bonds to ensure performance and durability in a variety of applications. Our range includes solutions that offer high thermal conductivity, electrical insulation, and resistance to environmental stress. Explore our innovative adhesives designed to improve production efficiency and product performance in the fast-paced world of electronics. Partner with Sadechaf to drive technological advancements and achieve optimal results in your projects.
Request your free sample today, or plan a meeting with our team of adhesive experts to find a solution for your application.
Sadechaf Surface Mount Adhesives
Adhesive | Chemistry | Components | Cure | Colour | Key-Properties | Viscosity @ 23°C | TDS | Sample |
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SPE 1888 | Epoxy | 1-part | Heat (+120°C) | Black & Fluorescent for in-line QC | Fast curing during reflow process between 195 – 230°C, Cures during Pb-free solder reflow while allowing self-alignment of IC components, Can be pre-applied to the board using a standard SMA dispenser, Toughened, Low-Outgassing, high Tg, Low shrinkage, Excellent Heat & Chemical resistance, Good weatherability, Electrically insulating, Gap filling, Tack-free cure, Excellent impact, shock and vibration resistance. | 86.000 mPas, Thixotropic gel | TDS SPE 1888 | Sample SPE 1888 |
SPE 1927 | Epoxy | 1-part | Heat (+120°C) | Black & Fluorescent for in-line QC | Toughened, Low outgassing, High Tg, Low Shrinkage, Resistant against High temperature (+150°C) and Thermal cycling, Resistant against aggressive Chemicals and Moisture, Electrically insulating, Gap filling, Excellent resistance against Shock, Vibration and Impact | 120.000 mPas | TDS SPE 1927 | Sample SPE 1927 |
Sadechaf Potting for electronic applications
Adhesive | Chemistry | Components | Cure | Colour | Key-Properties | Viscosity @ 23°C | TDS | Sample |
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UVAPLUS 8833 | Acrylate | 1-part | UV / UV-LED & Heat | Clear/Yellow | Flexible Potting/Encapsulant/Sealing product, Low E-modulus, Resistant against High temperature (+150°C) and Thermal shock (-40°C to +150°C), Excellent resistance against aggressive chemicals, such as oil and glycol, and moisture, Good electrical insulating properties, Excellent resistance against Shock, Vibration and Impact | 50.000 mPas | TDS UVAPLUS 8833 | Sample UVAPLUS 8833 |
Sadechaf Thermal Management Adhesives & TIM's
Adhesive | Chemistry | Components | Cure | Colour | Key-properties | Viscosity @ 23°C | TDS | Sample |
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UVAPLUS 8566 | Acrylate | 1-part | UV & UV-LED, Heat, Anaerobic, Activator | White | Thermal conductivity: 1,25 W/mK Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Fast UV cure, heat cure from +65°C or room temperature cure. Electrical insulating. | 5.380mPas, Thixotropic gel | TDS UVAPLUS 8566 | Sample UVAPLUS 8566 |
UVAPOX 6484 | Epoxy | 1-part | Heat | White | Thermal conductivity: 1,00 W/mK. Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Heat cure from +80°C. Electrical insulating. | 5.200 mPas, Thixotropic gel | TDS UVAPOX 6484 | Sample UVAPOX 6484 |
UVAPOX 6683 | Epoxy | 1-part | Heat | White | Thermal conductivity: 1,00 W/mK. Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Spacer of 50µm. Heat cure from +80°C. Electrical insulating. | 5.200 mPas, Thixotropic gel | TDS UVAPOX 6683 | Sample UVAPOX 6683 |
UVAPOX 6693 | Epoxy | 1-part | Heat | White | Thermal conductivity: 1,03 W/mK. High strength, High Tg product. Non abrasive product. Temperature resistant up to +200°C. Moisture and chemical resistant. Heat cure from +80°C. Electrical insulating. | 6750 mPas, Thixotropic gel | TDS UVAPOX 6693 | Sample UVAPOX 6693 |
Sadechaf Active Alignment Adhesives
Adhesive | Chemistry | Components | Cure | Colour | Key-Properties | Viscosity @ 23°C | TDS | Sample |
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UVACRYL 2151 | Acrylate | 1-part | UV & UV-LED | Grey | Low shrinkage, low CTE, High strength and Tg for precision bonding up to µm. | 35.000 mPas, Thixotropic gel | TDS UVACRYL 2151 | Sample UVACRYL 2151 |
UVAPLUS 8696 M2 | Acrylate | 1-part | UV & UV-LED, Heat | Optically clear | Strong adhesion to common and difficult to bond Plastics (COP, LCP, PPE+PS), Glass and Metals, High strength, High Tg, Fast UV cure, Low temperature Heat cure. | 14.000 mPas | TDS UVAPLUS 8696M2 | Sample UVAPLUS 8696M2 |