Thermal Management Adhesives & TIM’s

Our advanced solutions for effective heat management are designed to enhance the performance and reliability of your electronic devices by ensuring superior heat dissipation. Whether you need adhesives for bonding heat sinks or high-performance thermal interface materials for efficient heat transfer, our portfolio covers a wide range of applications. Explore our innovative solutions that help manage temperature, improve device longevity, and boost overall efficiency. Discover the right adhesive to keep your technology cool under pressure.

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Sadechaf Thermal Management Adhesives & TIM's

Adhesive Chemistry Components Cure Colour Key-properties Viscosity @ 23°C TDS Sample
UVAPLUS 8566 Acrylate 1-part UV & UV-LED, Heat, Anaerobic, Activator White Thermal conductivity: 1,25 W/mK Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Fast UV cure, heat cure from +65°C or room temperature cure. Electrical insulating. 5.380mPas, Thixotropic gel TDS UVAPLUS 8566 Sample UVAPLUS 8566
UVAPOX 6484 Epoxy 1-part Heat White Thermal conductivity: 1,00 W/mK. Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Heat cure from +80°C. Electrical insulating. 5.200 mPas, Thixotropic gel TDS UVAPOX 6484 Sample UVAPOX 6484
UVAPOX 6683 Epoxy 1-part Heat White Thermal conductivity: 1,00 W/mK. Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Spacer of 50µm. Heat cure from +80°C. Electrical insulating. 5.200 mPas, Thixotropic gel TDS UVAPOX 6683 Sample UVAPOX 6683
UVAPOX 6693 Epoxy 1-part Heat White Thermal conductivity: 1,03 W/mK. High strength, High Tg product. Non abrasive product. Temperature resistant up to +200°C. Moisture and chemical resistant. Heat cure from +80°C. Electrical insulating. 6750 mPas, Thixotropic gel TDS UVAPOX 6693 Sample UVAPOX 6693

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