Thermal Management Adhesives

Our specialised thermally conductive adhesives support heat dissipation and thermal guidance. These adhesives are also used for engineering solutions where TIM’s or Thermal Interface Material is essential.

Heat dissipation is critical in a variety of products such as electric motors, LEDs and heat sink components in electronic devices. Many new applications in e-mobility are made possible with the use of Thermal Management Adhesives.

Core line up of Sadechaf Thermal Management Adhesives

Adhesive Chemistry Component Cure Colour Key properties/application Viscosity @ 23°C TDS Sample
UVAPLUS 8566 Acrylate 1-part Multi-cure (UV, Heat, anaerobic and activator) White Thermal conductivity: 1,25 W/mK Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Fast UV cure, heat cure from +65°C or room temperature cure. Electrical insulating. 5380mPas, thixotropic gel TDS UVAPLUS 8566 Sample UVAPLUS 8566
UVAPOX 6484 Epoxy 1-part Heat cure White Thermal conductivity: 1,00 W/mK. Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Heat cure from +80°C. Electrical insulating. 5200 mPas, thixotropic gel TDS UVAPOX 6484 Sample UVAPOX 6484
UVAPOX 6683 Epoxy 1-part Heat cure White Thermal conductivity: 1,00 W/mK. Flexible product ideal for low stress joints and bonding dissimilar substrates. Non abrasive product. Spacer of 50µm. Heat cure from +80°C. Electrical insulating. 5200 mPas, thixotropic gel TDS UVAPOX 6683 Sample UVAPOX 6683
UVAPOX 6693 Epoxy 1-part Heat cure White Thermal conductivity: 1,03 W/mK. High strength, High Tg product. Non abrasive product. Temperature resistant up to +200°C. Moisture and chemical resistant. Heat cure from +80°C. Electrical insulating. 6750 mPas thixotropic gel TDS UVAPOX 6693 Sample UVAPOX 6693